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Nexensor · Technology partner
Wafer metrology & inspection
Explore six systems: FM1, ACM1, CWS1, CFM1, TM1 and HDM1.
Technology at a glance
Warpage Suite
FM1 and CWS1 provide high-speed 3D wafer and chip warpage measurement.
Micro-pattern Metrology
ACM1 measures CD, thickness, overlay and TIR for RDL/u-bumps.
CMP / Dishing
CFM1 and HDM1 address flatness, roughness and HCB dishing measurement.
TSV Metrology
TM1 offers high-repeatability TSV depth and TCD measurement.