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SBT · Technology partner
Ultrasonic inspection & packaging equipment
Ultrasonic inspection, terminal/pin welding, wire bonding and die attach systems.
Technology at a glance
Wafer SAT
Wafer400-A4/B2 systems for fully automatic inline and semi-automatic offline wafer acoustic inspection.
Welding + Bonding
Ultrasonic terminal/pin welding and copper/aluminum wire bonding for packaging interconnects.
Die Attach
SDB die attach systems cover cold/hot attach, flip-chip, eutectic and TCB processes.